CAD Tools for 3-Dimensional VLSI Circuits

Award Information
Agency:
Department of Defense
Branch
Defense Advanced Research Projects Agency
Amount:
$375,000.00
Award Year:
2003
Program:
SBIR
Phase:
Phase II
Contract:
DAAH0103CR174
Agency Tracking Number:
02SB1-0264
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
ORORA DESIGN TECHNOLOGIES, INC.
17371 NE 67th Court, Redmond, WA, 98052
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
010947088
Principal Investigator:
Monte Mar
Chief Scientist
(425) 702-9196
monte.mar@orora.com
Business Contact:
Tracey Luo
VP Business Manager
(425) 702-9196
tracey.luo@orora.com
Research Institution:
n/a
Abstract
Three-dimensional (3-D) circuit integration offers significant potential for the performance and density improvement over existing 2-D integration. However, the development of 3-D integrated circuits is hampered by lack of design tools and the problem ofheat dissipation in 3-D structures. To address these issues, Orora Design Technologies (ODT) proposes to develop and demonstrate a thermal-aware design methodology and enabling 3-D CAD tools. The proposed methodology models the coupled electrical andthermal performances of 3-D circuits using IEEE standard VHDL-AMS. The CAD tools to be developed include 3-D design capture, 3-D extraction of thermal and electrical networks, 3-D visualization, and a tool for simultaneous optimization of electrical,thermal, and physical properties of a 3-D design. Further, innovative techniques will be developed for the rapid analysis of how critical circuit performances are affected by 3-D temperature distribution, and algorithms for automatic thermal-aware 3-Dplacement and routing will be studied. The proposed tools will be validated and demonstrated on several military design cases.

* information listed above is at the time of submission.

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