Hierarchical CAD Tools for Radiation Hardened Mixed Signal Electronic Circuits

Award Information
Agency:
Department of Defense
Amount:
$99,000.00
Program:
SBIR
Contract:
W31P4Q-04-C-R080
Solitcitation Year:
2003
Solicitation Number:
2003.2
Branch:
Defense Advanced Research Projects Agency
Award Year:
2004
Phase:
Phase I
Agency Tracking Number:
03SB2-0361
Solicitation Topic Code:
SB032-043
Small Business Information
ORORA DESIGN TECHNOLOGIES, INC.
17371 NE 67th Court, Suite 205, Redmond, WA, 98052
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
010947088
Principal Investigator
 Monte Mar
 Chief Scientist
 (425) 702-9196
 monte.mar@orora.com
Business Contact
 Tracy Luo
Title: Vice President Business O
Phone: (425) 702-9196
Email: tracey.luo@orora.com
Research Institution
N/A
Abstract
Orora Design Technologies proposes to develop and demonstrate a behavioral-modeling-centric design flow and supporting CAD tools for the automated analysis, synthesis and migration of radiation-hardened mixed-signal integrated circuits and systems, based on IEEE standard VHDL-AMS. Parasitic-aware behavioral modeling methods and models will be developed to characterize radiation effects on circuit blocks, interconnect and layout structures. Orora will develop tools for encapsulating and quantifying known techniques for rad-hard circuit layout and architecture, as well as tools to predict routing sizing adjustments needed for radiation induced events. The existing Orora Arsyn tool suite will be extended to support hierarchical synthesis through topology selection under radiation, physical, and electrical constraints through parameterized VHDL-AMS netlists. VHDL-AMS facilitates simultaneous simulation and evaluation of electrical, thermal, and radiation effects, and encapsulation of design knowledge for rad-hard process migration. Teaming up Boeing Solid State Electronics, the proposed design flow and tools will be validated and demonstrated on some military electronic designs.

* information listed above is at the time of submission.

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