PIBO Dielectric Film for Advanced Microelectronics Packaging

Award Information
Agency:
Department of Defense
Branch:
Missile Defense Agency
Amount:
$64,724.00
Award Year:
2001
Program:
STTR
Phase:
Phase I
Contract:
F33615-01-M-2174
Agency Tracking Number:
01-0028T
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
OXAZAGEN, INC.
1910 West St. Andrews Road, Midland, MI, 48640
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
933678369
Principal Investigator
 David Dalman
 Business Devel. Mgr.
 (517) 832-5555
 dalman@mmi.org
Business Contact
 Robert Nowak
Title: President / CEO
Phone: (517) 832-5555
Email: nowak@mmi.org
Research Institution
 MICHIGAN MOLECULAR INSTITUTE
 Robert M Nowak
 1910 West St. Andrews Road
Midland, MI, 48640
 (517) 832-5555
 Domestic nonprofit research organization
Abstract
Electronics products in applications including mobile communications, work stations, small computers, automotive controls, and aerospace and military weapons systems are moving relentlessly toward smaller, thinner, and lighter formats in lower costpackages. Interconnect density requirements in these products are rapidly outstripping that which is achievable through fabrication of traditional multilayer printed wiring boards derived from currently available dielectric materials.Polyimidebenzoxazole (PIBO) film has low dielectric constant, low dissipation factor, low CTE, and excellent dimensional stability. These properties are a near-perfect match with requirements for dielectric substrates for next generation electronicspackaging.PIBO dielectric film would offer significant advantage for use as a superior dielectric substrate for use in primary (chip scale, flip chip, ball grad array) or secondary (motherboard) packaging of integrated circuits. Potential end useapplications include high frequency (microwave, mobile communications, digital) and high-end MLPWBS. Market potential for PIBO film in these applications exceeds $200 million per year.

* information listed above is at the time of submission.

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