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PC-BASED EXPERT SYSTEM FOR THERMAL ANALYSIS OF ELECTRONIC EQUIPMENT
Phone: (603) 643-3800
THERMAL EVALUATION OF ELECTRONIC MODULES AND SYSTEMS FOR RELIABILITY IN THE EARLY STAGES OF DESIGN WOULD PROVIDE COST AND TIME SAVINGS BY AVOIDING REDESIGN OR MODIFICATION OF COMPLETED DESIGNS. SYSTEM AND RELIABILITY ENGINEERS NEED A THERMAL ANALYSIS TOOL THAT DOES NOT REQUIRE HEAT TRANSFER EXPERTISE OR DETAILED INPUT DATA SO THAT EVALUATION CAN TAKE PLACE EARLY IN THE DESIGN PROCESS. THIS PROJECT PROPOSES TO DEMONSTRATE THE FEASIBILITY OF A PC-BASED THERMAL ANALYZER BASED ON AN EXPERT SYSTEM. THE SOFTWARE WILL ESTIMATE COMPONENT TEMPERATURES AND PROVIDE WARNINGS WHEN TEMPERATURES EXCEED SPECIFIED LIMITS USING A SIMPLE INPUT DESCRIPTION OF THE DESIGN AND ASSUMING NO HEAT TRANSFER EXPERTISE ON THE PART OF THE USER. UNSPECIFIED INPUTS WILL BE ESTIMATED WITHIN CONSTRAINTS. THE OBJECTIVE OF THE PHASE I PROJECT IS TO SHOW THAT SUCH A PROGRAM IS ACHIEVABLE AND WILL MEET THE NEEDS OF SYSTEM AND RELIABILITY ENGINEERS. DETAILED SOFTWARE SPECIFICATIONS WILL BE DEVELOPED.
* Information listed above is at the time of submission. *