HIGH PERFORMANCE THERMOELECTRIC HEAT SINK
Small Business Information
P O Box 71, Hanover, NH, 03755
Javier A Valenzuela
Abstract1An innovative approach for increasing the cooling capacity and efficiency of miniature thermoelectric coolers is proposed. Compared with current thermoelectric coolers, the proposed device will have three major advantages: (1) almost a factor of two increase in maximum cooling capacity, (2) several fold increase in efficiency (when operating at cooling loads comparable to that of present devices), and (3) very compact packaging. These features will allow effective cooling of high heat dissipation and temperature sensitive devices in high density electronic packaging applications. In Phase I we will quantify through analysis the potential gains in performance and evaluate the feasibility and cost of fabricating the device. If proven feasible, we will design a prototype thermoelectric cooler to be fabricated and tested in Phase II.
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