EASILY PROCESSED HIGH TEMPERATURE PRIMER/ADHESIVE SYSTEM

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$56,942.00
Award Year:
1990
Program:
SBIR
Phase:
Phase I
Contract:
n/a
Agency Tracking Number:
12801
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Pda Engineering
3754 Hawkins Ne, Albuquerque, NM, 87109
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Ronald E Allred
(505) 344-4967
Business Contact:
() -
Research Institution:
n/a
Abstract
DEVELOPMENT OF REACTIVE PRIMER/MODIFIED PHENOLIC ADHESIVE SYSTEM IS PROPOSED FOR BONDING RADOME MATERIALS. INITIAL STUDIES HAVE SHOWN THAT THE REACTIVE PRIMER CHEMISTRY WILL FORM CHEMICAL BONDS WITH METALS, CERAMICS AND POLYMERS. A TWO-STAGE PRIMER IS PROPOSED THAT CAN BE BONDED TO A RADOME SUBSTRATE AND AN ADHESIVE IN TWO SEPARATE OPERATIONS, EITHER BY TEMPERATURE, ACTINIC LIGHT OR A COMBINATION OF THESE. THE MODIFIED PHENOLIC ADHESIVE HAS EXCELLENT HIGH TEMPERATURE PROPERTIES AND CURES WITHOUT VOLATILE EVOLUTION AT TEMPERATURES NEAR 200 DEG C. THE COMBINATION PRIMER/ADHESIVE SYSTEM CAN BE EASILY PROCESSED TO FORM WELL-ADHERED, HIGH STRENGTH, HEAT RESISTANT JOINTS WITH A VARIETY OF RADOME MATERIALS.

* information listed above is at the time of submission.

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