EASILY PROCESSED HIGH TEMPERATURE PRIMER/ADHESIVE SYSTEM

Award Information
Agency:
Department of Defense
Branch:
Navy
Amount:
$56,942.00
Award Year:
1990
Program:
SBIR
Phase:
Phase I
Contract:
N/A
Agency Tracking Number:
12801
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Pda Engineering
3754 Hawkins Ne, Albuquerque, NM, 87109
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
N/A
Principal Investigator
 Ronald E Allred
 (505) 344-4967
Business Contact
Phone: () -
Research Institution
N/A
Abstract
DEVELOPMENT OF REACTIVE PRIMER/MODIFIED PHENOLIC ADHESIVE SYSTEM IS PROPOSED FOR BONDING RADOME MATERIALS. INITIAL STUDIES HAVE SHOWN THAT THE REACTIVE PRIMER CHEMISTRY WILL FORM CHEMICAL BONDS WITH METALS, CERAMICS AND POLYMERS. A TWO-STAGE PRIMER IS PROPOSED THAT CAN BE BONDED TO A RADOME SUBSTRATE AND AN ADHESIVE IN TWO SEPARATE OPERATIONS, EITHER BY TEMPERATURE, ACTINIC LIGHT OR A COMBINATION OF THESE. THE MODIFIED PHENOLIC ADHESIVE HAS EXCELLENT HIGH TEMPERATURE PROPERTIES AND CURES WITHOUT VOLATILE EVOLUTION AT TEMPERATURES NEAR 200 DEG C. THE COMBINATION PRIMER/ADHESIVE SYSTEM CAN BE EASILY PROCESSED TO FORM WELL-ADHERED, HIGH STRENGTH, HEAT RESISTANT JOINTS WITH A VARIETY OF RADOME MATERIALS.

* information listed above is at the time of submission.

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