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Science and Applications of Metameterials to Interceptor Sensors

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0006-09-C-7076
Agency Tracking Number: B08B-009-0005
Amount: $99,592.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: MDA08-T009
Solicitation Number: 2008.B
Timeline
Solicitation Year: 2008
Award Year: 2009
Award Start Date (Proposal Award Date): 2009-02-17
Award End Date (Contract End Date): 2009-08-17
Small Business Information
760 Parkside Avenue Room 313
Brooklyn, NY 11226
United States
DUNS: 145785528
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 David Crouse
 Assistant Professor
 (212) 650-5330
 david.thomas.crouse@gmail.com
Business Contact
 Thomas James
Title: President
Phone: (718) 484-7033
Email: thomas.l.james@gmail.com
Research Institution
 Research Foundation - City College
 Regina Masterson
 
160 Convent Avenue
New York, NV 10031-9101
United States

 (212) 650-7908
 Nonprofit College or University
Abstract

In Phase I, Phoebus Optoelectronics will assess the feasibility of using the diverse, enabling light management capabilities of subwavelength-scale metal/dielectric materials called "Plasmonic/Photonic Hybrid Crystals," a recently-discovered subset of Z/NIM metamaterials, to develop higher-performance, lower-cost components for infrared sensing related to interceptor systems. Our hybrid crystals, single-layer surface structures, can be fabricated atop any substrate material using standard CMOS fabrication techniques. Designs for two unique polarimetric infrared focal plane arrays will be developed for the 7-12 micron wavelength regime. The designs will use combinations of optical and electromagnetic modes within subwavelength periodic structures that elicit the Z/NIM effects of anomalous transmission and super beaming. Our structures will readily achieve polarization extinction ratios of 500:1 (compared with 20:1 for current commercial devices), will minimize crosstalk, and will reduce fabrication costs through component integration.

* Information listed above is at the time of submission. *

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