HIGH THERMAL CONDUCTIVITY ELECTRONIC SUBSTRATE

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: N/A
Agency Tracking Number: 10035
Amount: $49,874.00
Phase: Phase I
Program: SBIR
Awards Year: 1989
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
Po Box 1883, La Jolla, CA, 92038
DUNS: N/A
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Bob L Mackey
 (619) 456-5476
Business Contact
Phone: () -
Research Institution
N/A
Abstract
WE PROPOSE TO INITIATE DEVELOPMENT OF A HIGH THERMAL CONDUCTIVITY PRINTED CIRCUIT BOARD (PCB) ASSEMBLY. USE OF A HEAT PIPE TECHNIQUE IS EXPECTED TO YIELD THERMAL CONDUCTIVITIES MANY TIMES THAT OF COPPER OR EXPENSIVE CERAMICS. THE PRINCIPLES OF HEAT PIPE OPERATION ARE DISCUSSED, AND A SIMPLE PRINTED CIRCUIT BOARD CONSTRUCTION IS PROPOSED TO TAKE ADVANTAGE OF THOSE PRINCIPLES. USE OF THIS TECHNIQUE PROMISES TO ELIMINATE DISCREET HEAT SINKS IN MANY APPLICATIONS. PHASE I WORK WILL DEMONSTRATE THE FEASIBILITY OF A HEAT PIPE/PRINTED CIRCUIT BOARD HYBRID. A COMPUTER MODEL WILL BE DEVELOPED AND USED TO OPTIMIZE THE DESIGN OF A PROTOTYPE. PROTOTYPE DEVICES TO BE FABRICATED AND TESTED IN PHASE II WORK WILL USE AVAILABLE MATERIALS AND CONSTRUCTION TECHNIQUES. THESE DEVICES WILL BE TESTED TO DETERMINE THEIR OPERATING LIMITS.

* Information listed above is at the time of submission. *

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