Three Dimensional Volumetric Terahertz Scanning for Aerospace Non Destructive Evaluation

Award Information
Agency:
National Aeronautics and Space Administration
Branch
n/a
Amount:
$100,000.00
Award Year:
2004
Program:
STTR
Phase:
Phase I
Contract:
NNL04AB52P
Award Id:
72095
Agency Tracking Number:
030213
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
2925 Boardwalk, Ann Arbor, MI, 48104
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
788133387
Principal Investigator:
David Zimdars
Principal Investigator
() -
dzimdars@picometrix.com
Business Contact:
Robin Risser
Business Official
(734) 864-5605
rrisser@picometrix.com
Research Institution:
William Marsh Rice University
Hiedi Thornton
6100 Main Street, MS-16
Houston, TX, 77251
(713) 348-5452
Nonprofit college or university
Abstract
In this Phase I STTR project, we propose to develop the critical innovations necessary for a high speed three dimesnional terahertz (THz) tomographic imaging system for aerospace non destructive evaluation (NDE) applcations. NASA and the Aerospace industry are beginning to utilize THz reflection imaging (for example, examining the space shuttle external tank sprayed on foam insulation for voids and disbonds). THz NDE imaging is widely applicable to composite resin, ceramic, plastic, natural, and other non-metallic materials. Current commercial equipment is capable of two dimensional raster scanning. The wider utility of THz NDE technology can be more fully exploited for the development of NASA and aerospace applications if the full potential for high speed three dimensional THz imaging is realized. The current state of the art equipment collects the THz waveform reflection from a very narrow depth range from a strongly reflective backing. The proposed innovations will increase the dynamic range of the THz waveform acquisition to allow collection of reflections from weaker interfaces, and will increase the window of high speed scanning of the THz waveform to allow three dimensional images to be reconstructed for objects many inches thick.

* information listed above is at the time of submission.

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