Three Dimensional Volumetric Terahertz Scanning for Aerospace Non Destructive Evaluation

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNL04AB52P
Agency Tracking Number: 030213
Amount: $100,000.00
Phase: Phase I
Program: STTR
Awards Year: 2004
Solicitation Year: 2003
Solicitation Topic Code: T7.02
Solicitation Number: N/A
Small Business Information
Picotronix, Inc. dba Picometrix, Inc.
2925 Boardwalk, Ann Arbor, MI, 48104-6765
DUNS: 788133387
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 David Zimdars
 Principal Investigator
 () -
 dzimdars@picometrix.com
Business Contact
 Robin Risser
Title: Business Official
Phone: (734) 864-5605
Email: rrisser@picometrix.com
Research Institution
 William Marsh Rice University
 Not Available
 6100 Main Street, MS-16
Houston, TX, 77251
 (713) 348-5452
 Domestic nonprofit research organization
Abstract
In this Phase I STTR project, we propose to develop the critical innovations necessary for a high speed three dimesnional terahertz (THz) tomographic imaging system for aerospace non destructive evaluation (NDE) applcations. NASA and the Aerospace industry are beginning to utilize THz reflection imaging (for example, examining the space shuttle external tank sprayed on foam insulation for voids and disbonds). THz NDE imaging is widely applicable to composite resin, ceramic, plastic, natural, and other non-metallic materials. Current commercial equipment is capable of two dimensional raster scanning. The wider utility of THz NDE technology can be more fully exploited for the development of NASA and aerospace applications if the full potential for high speed three dimensional THz imaging is realized. The current state of the art equipment collects the THz waveform reflection from a very narrow depth range from a strongly reflective backing. The proposed innovations will increase the dynamic range of the THz waveform acquisition to allow collection of reflections from weaker interfaces, and will increase the window of high speed scanning of the THz waveform to allow three dimensional images to be reconstructed for objects many inches thick.

* information listed above is at the time of submission.

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