Enhanced Blackbody Sensors for the Quench Module Insert

Award Information
Agency:
National Aeronautics and Space Administration
Amount:
$599,997.00
Program:
SBIR
Contract:
NNM04AA13C
Solitcitation Year:
2002
Solicitation Number:
N/A
Branch:
N/A
Award Year:
2004
Phase:
Phase II
Agency Tracking Number:
023215
Solicitation Topic Code:
B1.02
Small Business Information
Plasma Processes, Inc.
4914 Moores Mill Road, Huntsville, AL, 35811-1558
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
799114574
Principal Investigator
 Scott ODell
 Principal Investigator
 (256) 851-7653
 scottodell@plasmapros.com
Business Contact
 Timothy McKechnie
Title: President
Phone: (256) 851-7653
Email: timmck@plasmapros.com
Research Institution
N/A
Abstract
Experiment Modules (EM) such as the Quench Module Insert (QMI) must be comprised of robust components to minimize the need for recalibration and refurbishment/replacement on the International Space Station. A critical aspect for proper operation of the QMI is thermal performance monitoring by blackbody sensors (BBS). Significant improvements in the ability of the sensor to monitor thermal performance can be realized by improving the joint quality between BBS rings and tantalum sheathed thermocouples. Modification of the sensor rings' surface properties to increase emissivity benefits thermal performance. In Phase I, novel laser brazing techniques have been developed for the production of robust joints between tantalum sheathed thermocouples and BBS rings. Additionally, an ultra high temperature tantalum carbide emissivity coating has been developed for use with tantalum sensor rings for improved radiative heat transfer properties. Thermal cycle testing demonstrated excellent joint quality of the enhanced BBS and the bond between TaC emissivity coatings and tantalum sensor rings. During Phase II, the techniques will be optimized such that enhanced flight quality BBS will be fabricated for testing in QMI furnaces at Marshall Space Flight Center.

* information listed above is at the time of submission.

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