Enhanced Blackbody Sensors for the Quench Module Insert

Award Information
Agency:
National Aeronautics and Space Administration
Branch
n/a
Amount:
$599,997.00
Award Year:
2004
Program:
SBIR
Phase:
Phase II
Contract:
NNM04AA13C
Award Id:
63253
Agency Tracking Number:
023215
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Plasma Processes, Inc. (Currently PLASMA PROCESSES, LLC)
4914 Moores Mill Road, Huntsville, AL, 35811
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
799114574
Principal Investigator:
Scott ODell
Principal Investigator
(256) 851-7653
scottodell@plasmapros.com
Business Contact:
Timothy McKechnie
President
(256) 851-7653
timmck@plasmapros.com
Research Institution:
n/a
Abstract
Experiment Modules (EM) such as the Quench Module Insert (QMI) must be comprised of robust components to minimize the need for recalibration and refurbishment/replacement on the International Space Station. A critical aspect for proper operation of the QMI is thermal performance monitoring by blackbody sensors (BBS). Significant improvements in the ability of the sensor to monitor thermal performance can be realized by improving the joint quality between BBS rings and tantalum sheathed thermocouples. Modification of the sensor rings' surface properties to increase emissivity benefits thermal performance. In Phase I, novel laser brazing techniques have been developed for the production of robust joints between tantalum sheathed thermocouples and BBS rings. Additionally, an ultra high temperature tantalum carbide emissivity coating has been developed for use with tantalum sensor rings for improved radiative heat transfer properties. Thermal cycle testing demonstrated excellent joint quality of the enhanced BBS and the bond between TaC emissivity coatings and tantalum sensor rings. During Phase II, the techniques will be optimized such that enhanced flight quality BBS will be fabricated for testing in QMI furnaces at Marshall Space Flight Center.

* information listed above is at the time of submission.

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