Novel Concepts for Next Generation Infrared (IR) Focal Plane Arrays (FPAs)

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0006-05-C-7145
Agency Tracking Number: 044-1425
Amount: $99,517.00
Phase: Phase I
Program: SBIR
Awards Year: 2005
Solicitation Year: 2004
Solicitation Topic Code: MDA04-173
Solicitation Number: 2004.4
Small Business Information
POLARIS SENSOR TECHNOLOGIES, INC.
5710 Jones Valley Drive, Huntsville, AL, 35802
DUNS: 129074840
HUBZone Owned: N
Woman Owned: Y
Socially and Economically Disadvantaged: N
Principal Investigator
 Michele Banish
 COO
 (256) 824-6547
 michele@polarissensor.com
Business Contact
 David Chenault
Title: President
Phone: (256) 824-6548
Email: david@polarissensor.com
Research Institution
N/A
Abstract
Photon detectors operating at long and very long wavelength infrared detection suffer from high leakage currents because of the small band gap inherently needed at that spectral range. Typical formats of present ROICs are 320 x 256 with a pitch of 30 µm. Thus, the absolute impedance of the sensitive pixels is only in the range between 1 Mohm and 100 kohm. For detection longer than 18 µm the values are even lower. A custom ROIC is a required development for the type II superlattice FPA. This effort offers ROIC technology that also masks unwanted data from read-out. Qualifying data eliminates the flood of null data in the processing pipeline. The approach leverages existing efforts. The technology dramatically improved images while buying back bandwidth for discrimination. Phase I experiments will identify the specifications and technology gaps. The team offers internal research resources, direct leverage of existing funding and an integration path to a Smart FPA. In Phase II, an FPA manufacturer will help implement the ROIC advancement. Polaris is currently collaborating with commercial FPA manufacturers to port this technology into commercial systems. In Phase II technology gaps will be addressed and designs will be developed for the ROIC.

* information listed above is at the time of submission.

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