SBIR Phase I: A Novel Manufacturing Method for Conformal, Embedded Electronics and Sensor Systems: Combining Thermal Spray with Laser Micromachining

Award Information
Agency: National Science Foundation
Branch: N/A
Contract: 0232829
Agency Tracking Number: 0232829
Amount: $99,987.00
Phase: Phase I
Program: SBIR
Awards Year: 2003
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
4445 Nicole Drive, Lanham-Seabrook, MD, 20706
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Chengping Zhang
 () -
Business Contact
Phone: () -
Research Institution
This Small Business Innovative Research (SBIR) Phase I project will develop an approach that combines two new, unique, and complimentary technologies to fabricate mesoscopic electronics and sensors. For example, thermal spray as an additive process to deposit a wide variety of high-quality ceramic, metal, semiconductor, polymer, etc. materials, with the precision subtractive capabilities of High-Speed High-Resolution Ultraviolet Laser Micromachining to fashion mesoscale (~10-1000 microns) devices on a wide range of substrates. The technology is based on a direct-write process that requires no masks, photoresist, or wet chemistry. The benefits of such a combined technology are vast, and will allow a dramatic reduction in feature size to the ~10 um level and below, while being able to utilize an enormous variety of materials and perform design iterations in a matter of minutes or hours, compared to the traditional 1-4+ week turn-around time for typical photoresist mask alterations/fabrication. The potential commercial applications are unique and far-reaching. Examples include strain gauges, thermistors, thermocouples, thermopiles, magnetic and piezoelectric sensors, interdigitated capacitors for LCR circuits, antennas, microheaters for integration into chemical and biological sensors, and others. The devices can be integrated into existing components and embedded or overcoated for added reliability and survivability in harsh environments.

* Information listed above is at the time of submission. *

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