Piezoelectric Structural Microensor Technology for Extreme Environments (> 1800 F)

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNX10CA27C
Agency Tracking Number: 084231
Amount: $599,914.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: A2.01
Solicitation Number: N/A
Solicitation Year: 2008
Award Year: 2010
Award Start Date (Proposal Award Date): 2010-03-04
Award End Date (Contract End Date): 2013-03-04
Small Business Information
2820 East College Avenue, State College, PA, 16801-7548
DUNS: 782683007
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Xiaoning Jiang
 Principal Investigator
 (814) 814-7485
Business Contact
 Wesley Hackenberger
Title: President
Phone: (814) 238-7485
Email: wes@trstechnologies.com
Research Institution
High temperature piezoelectric crystal (HTPC) sensors are desired for future propulsion component structure health monitoring, operating parameters optimization, turbine engine control and health monitoring, as well as improving performance and maintainability of power production facilities and other rotary combustion engines. Recently discovered high temperature piezoelectrics showed stable piezoelectric properties and high resistivity at temperatures close to its melting point (~ 1500 C) , which is very promising for high temperature sensor applications. The Phase I results demonstrated excellent temperature sensing and vibration sensing performance at temperature up to 1000 C (> 1800 F). In Phase II, low profile HTPC microsensors design, fabrication and attachment will be further investigated and optimized. Highly sensitive HTPC piezoelectric structural microsensors will be prototyped and characterized for temperature, stress and acceleration measurements at temperatures up to 2000 oF. HTPC microsensor reliability will also be studied in Phase II. HTPC microsensors will significantly advance NASA, DOD and industrial high temperature measurements because of their low profile, simple structure, high sensitivity, quick response, and high reliability.

* Information listed above is at the time of submission. *

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