Long Term Missile Aging Reliability Prediction for Lead-Free Solder Interconnects

Award Information
Agency: Department of Defense
Branch: Army
Contract: W31P4Q-06-C-0175
Agency Tracking Number: A052-137-1815
Amount: $69,724.00
Phase: Phase I
Program: SBIR
Awards Year: 2006
Solicitation Year: 2005
Solicitation Topic Code: A05-137
Solicitation Number: 2005.2
Small Business Information
811 Court St., Utica, NY, 13502
DUNS: 124152138
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Seymour Morris
 Senior Engineer
 (315) 732-0097
Business Contact
 Preston MacDiarmid
Title: President
Phone: (315) 732-0097
Email: pmacdiarmid@quanterion.com
Research Institution
Because lead is a toxic metal, uses of it that affect the environment are a health risk. Less widely known than paint, gasoline, and batteries is the significant concern associated with ground water leaching of lead-based solder from electronics disposed of in landfills. Although many states have legislation regarding becoming lead-free, the US aerospace industry is, to some extent, being swept along with the international lead-free movement. The AMRDEC is faced with the problem of reliability-over-time, because its missiles are stored for years. Its Stockpile Reliability Programs (SRP) have maintained the necessary levels of reliability at an affordable cost. Now, with the transition to lead-free connections, a whole new set of challenges arises because their reliability is unknown. AMRDEC, as part of the TCG for "Predictive Materials Aging and Reliability," is developing tools to help in the SRP process. Sandia is using finite element analysis to simulate the effects of input variables of the solder characteristics and the environmental stresses over time to identify damage to the lead-free solder joints. This Phase I effort will take the Sandia results and expand them into a reliability prediction tool that can be used in trading-off parameters in making SRP decisions for missiles.

* Information listed above is at the time of submission. *

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