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Low Profile Multi-Mode Tamper Detection Sensors

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8650-07-C-8102
Agency Tracking Number: O053-A01-1128
Amount: $749,996.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: OSD05-A01
Solicitation Number: 2005.3
Solicitation Year: 2005
Award Year: 2007
Award Start Date (Proposal Award Date): 2007-04-17
Award End Date (Contract End Date): 2009-04-17
Small Business Information
350 Wynn Drive
Huntsville, AL 35805
United States
DUNS: 031994218
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Joseph Frederick
 Principal Investigator
 (937) 320-0966
Business Contact
 Victor Balch
Title: Director of Contracts
Phone: (256) 489-1742
Research Institution

A multi-layered approach to tamper detection is emerging that consists of two complementary sensor technologies: micro-electro-mechanical-system (MEMS) vibrational sensors to detect acoustic and grinding threats, and a nanoparticle-doped thin film sensor that is responsive to x-ray and focused ion beam (FIB) radiation. The sensors not only will detect an attack, but also characterize it, and a report or a penalty response may be invoked. The size of these cantilevers will allow multiple redundancies for multiple frequencies without impacting the host device. In Phase I it was clearly demonstrated that multiple micro-cantilever beam arrays can be designed that will cover multiple frequency bands. The thin film is covert, requires no maintenance, does not affect the performance of the device being protected, is projected to be inexpensive to fabricate and apply, and since the material chemistry is highly stable, it should have a long shelf life. Importantly, since these technologies do not affect the performance of the device, they are applicable to legacy as well as new systems. Phase II will continue the advanced development of these technologies, leading to a product that is producible and cost-effective for military or commercial uses.

* Information listed above is at the time of submission. *

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