Low Power Electronics and Energy Harvesting for Anti-tamper Applications

Award Information
Agency: Department of Defense
Branch: Army
Contract: W31P4Q-09-C-0036
Agency Tracking Number: A082-034-0267
Amount: $69,977.00
Phase: Phase I
Program: SBIR
Awards Year: 2008
Solicitation Year: 2008
Solicitation Topic Code: A08-034
Solicitation Number: 2008.2
Small Business Information
350 Wynn Drive, Huntsville, AL, 35805
DUNS: 031994218
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Joe Frederick
 Principal Investigator
 (937) 320-0966
Business Contact
 Victor Balch
Title: Director of Contracts
Phone: (256) 489-8966
Email: vbalch@radiancetech.com
Research Institution
The proposed research will couple an energy harvester device with an energy storage device, to provide onboard power for anti-tamper sensors that operate unattended over extended periods of time. The proposed concept consists of arrays of micro-cantilever beams that are fabricated from piezoelectric material. The power produced from a grinding or scanning acoustic microscopy attack, or from environmental vibrational energy, can either power an AT sensor or trigger or be stored for later use. Our team proposes to design these arrays so they can be placed in an environment where they will sense vibration-based interrogation, or scavenge environmental vibrational energy that would otherwise go unused. Associated micro-circuitry will store and use this energy. This concept will provide micro to milliwatts of electrical power to operate AT sensors. There are many sources of acoustic and vibrational energy that can be harvested in order to provide power for chemical/biological sensors to give early warning of a terrorist attack, or they cn be placed in the high acoustic and vibration-rich environment of a propulsion system engine bay to monitor health-monitoring systems. The micro-beams are robust and long-lived, they require no user intervention, and they will provide an easy retrofit capability for legacy systems.

* Information listed above is at the time of submission. *

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