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COMPOSITES FOR INTEGRAL DIELECTRIC/HEAT SINK FOR ELECTRONIC DEVICES

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N/A
Agency Tracking Number: 10110
Amount: $49,971.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1989
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
2200 Amapola Ct - Ste 101
Torrance, CA 90405
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 William C Riley
 (213) 533-5149
Business Contact
Phone: () -
Research Institution
N/A
Abstract

THE OBJECTIVE OF THIS PROGRAM IS TO SHOW THE FEASIBILITY OF FABRICATING AN INTEGRAL DIELECTRIC/HEAT SINK USING ORGANIC MATRIX COMPOSITES. SEM E PROPERTY REQUIREMENTS WILL BE GOALS. HIGH THERMAL CONDUCTIVITY GRAPHIT FIBERS (1100 W/M DEG K) WILL BE USED TO ACHIEVE THE SEM E HEAT SINK THERMAL CONDUCTIVITY REQUIREMENT. THE USE OF THESE FIBERS WILL LEAD TO A NEGATIVE EXPANSION IN THE HEAT SINK. THEREFORE, METAL ADDITONS TO THE HEAT SINK WILL BE MADE TO INCREASE THE THERMAL EXPANSION TO MATCH THE GLASS-EPOXY SEM E DIELECTRIC. IT IS PLANNED TO USE BOTH A COPPER-COATED GRAPHITE FIBER TOW AND GRAPHITE-ALUMINUM WIRE FOR THIS PURPOSE. THIS TECHNOLOGY WILL BE DEMONSTRATED IN BOTH EPOXY AND THERMOPLASTIC COMPOSITES. HEAT SINK JOINING TO THE DIELECTRIC WILL BE ACCOMPLISHED BY CO-CURING OR COMPRESSION MOLDING. EVALUATION WILL BE BASED ON THERMAL AND MECHANICAL PROPERTIES MEASURED BEFORE AND AFTER THERMAL CYCLING, USING SEM E SPECIFICATIONS. OF PARTICULAR IMPORTANCE IS A COMPARISON OF PROPERTIES OF THE INTEGRAL DIELECTRIC/HEAT SINK WITH ADHESIVELY BONDED COMPONENTS. SYSTEM IMPACT ASSESSMENT WILL INCLUDE A COMPARISON OF THE POTENTIAL OF ORGANIC MATRIX COMPOSITES WITH CERAMIC MATERIALS SUCH AS BEO.

* Information listed above is at the time of submission. *

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