Embedded Microexplosives for Secure Hardware (EMESH)

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: F33615-02-M-5023
Agency Tracking Number: 021ML-2117
Amount: $99,928.00
Phase: Phase I
Program: SBIR
Awards Year: 2002
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
Research Support Instruments
4325-B Forbes Blvd, Lanham, MD, 20706
DUNS: 082602590
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Jon Fox
 Principal Scientist
 (609) 580-0080
Business Contact
 Michael Corson
Title: Vice President
Phone: (301) 306-0010
Email: corson@researchsupport.com
Research Institution
The EMESH program will deliver hard, epoxy based materials embedded with microscale quantities of micro explosives (mu X) for tamper-reactivity. Using the same high aspect MEMS photosensitive epoxies the EMESH project will produce demonstration circuit traces which use all three dimensions above the substrate (or circuit board).Using "thick" resists as a material to embed both complex three dimensional circuit traces and microexplosive mine fields, it is now possible to construct secure hardware using UV photolithography and electroless metal deposition. Because of technologicaladvances in the world of micro electro mechanical systems (MEMS), the same techniques used to assemble micro-sized components to replace macro systems can now be applied to the problem of infrastructure protection and tamper-resistant and reactivehardware. A tamper reactive material would deny attackers the ability to dissect components by imparting damage to critical areas -- rendering the device inoperative. Additionally, EMESH architecture is also inherently difficult to reverse engineer. MEMS techniques can produce circuit traces with a cross-sectional profile only microns in dimension.Furthermore, tamper-proof circuit traces using MEMS electroforming techniques can use all three dimensions to bewilder an attacker attempting to understand the device's design.

* information listed above is at the time of submission.

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