Advanced Fault and Failure Anomaly Detection Technologies to Support Enhanced Prognostic and Health Monitoring (PHM) Capabilities

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$1,595,850.00
Award Year:
2006
Program:
SBIR
Phase:
Phase II
Contract:
N68335-06-C-0246
Agency Tracking Number:
N043-258-0836
Solicitation Year:
2004
Solicitation Topic Code:
N04-258
Solicitation Number:
2004.3
Small Business Information
RIDGETOP GROUP, INC.
6595 North Oracle Road, Suite 153B, Tucson, AZ, 85704
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
Y
Duns:
005128988
Principal Investigator:
James Hofmeister
Principal Investigator
(520) 742-3300
hoffy@ridgetop-group.com
Business Contact:
Douglas Goodman
President and CEO
(520) 742-3300
doug@ridgetop-group.com
Research Institution:
n/a
Abstract
Solder-joint damage is accumulative and results in increased crack growth rate and in increased frequency of high-resistance spikes. These faults typically manifest themselves as intermittent, hard-to-diagnose faults in which incorrect FPGA output signals occur. These intermittent faults increase in frequency, last longer and longer and lead to persistent failure. The relative high density of the solder balls (also referred to as solder bumps) of BGA packages is a major “hard-to-diagnose” contributing factor. Ridgetop proposes to develop two innovative initial designs into prototype electronic prognostic cells to detect damage to solder-joint networks of fully operational Field Programmable Gate Arrays (FPGAs) in a ball-grid array (BGA) packages such as XILINX’s FG1156.

* information listed above is at the time of submission.

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