Advanced Fault and Failure Anomaly Detection Technologies to Support Enhanced Prognostic and Health Monitoring (PHM) Capabilities

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-06-C-0246
Agency Tracking Number: N043-258-0836
Amount: $1,595,850.00
Phase: Phase II
Program: SBIR
Awards Year: 2006
Solicitation Year: 2004
Solicitation Topic Code: N04-258
Solicitation Number: 2004.3
Small Business Information
RIDGETOP GROUP, INC.
6595 North Oracle Road, Suite 153B, Tucson, AZ, 85704
DUNS: 005128988
HUBZone Owned: N
Woman Owned: Y
Socially and Economically Disadvantaged: N
Principal Investigator
 James Hofmeister
 Principal Investigator
 (520) 742-3300
 hoffy@ridgetop-group.com
Business Contact
 Douglas Goodman
Title: President and CEO
Phone: (520) 742-3300
Email: doug@ridgetop-group.com
Research Institution
N/A
Abstract
Solder-joint damage is accumulative and results in increased crack growth rate and in increased frequency of high-resistance spikes. These faults typically manifest themselves as intermittent, hard-to-diagnose faults in which incorrect FPGA output signals occur. These intermittent faults increase in frequency, last longer and longer and lead to persistent failure. The relative high density of the solder balls (also referred to as solder bumps) of BGA packages is a major “hard-to-diagnose” contributing factor. Ridgetop proposes to develop two innovative initial designs into prototype electronic prognostic cells to detect damage to solder-joint networks of fully operational Field Programmable Gate Arrays (FPGAs) in a ball-grid array (BGA) packages such as XILINX’s FG1156.

* information listed above is at the time of submission.

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