Radiation Hardening Designs and Techniques for Missile Defense

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$99,957.00
Award Year:
2007
Program:
SBIR
Phase:
Phase I
Contract:
HQ0006-07-C-7764
Award Id:
81769
Agency Tracking Number:
B063-043-0315
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
6595 North Oracle Road, Suite 153B, Tucson, AZ, 85704
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
157955597
Principal Investigator:
Douglas Goodman
Principal Investigator
(520) 742-3300
doug@ridgetop-group.com
Business Contact:
Douglas Goodman
President and CEO
(520) 742-3300
doug@ridgetop-group.com
Research Institute:
n/a
Abstract
Together with its supporting partner, Raytheon Missile Systems, the objective of this SBIR proposal is to design a high resolution, high speed 100 MSPS, 14 bit, radiation-hardened Analog-to-Digital Converter (ADC) for critical KEI and Missile applications. This is considered an aggressive goal, since the commercial state-of-the-art ADC is a 12-bit (resolution) 80 MSPS (speed) ADC. However, Ridgetop has developed a unique approach that will meet that goal combining circuit design innovation, with an innovative silicon process. Commercial high performance ADCs are not radiation hardened and may be incapable of reliably operating in the strategic radiation environment for the projected design-life of deployed system. Another benefit, owing to the structure of the FlexfetT is radiation tolerance. Ridgetop will design a 100 mega sample per second (MSPS), 14-bit ADC, to be manufactured in the American Semiconductor Silicon-on-Insulator (SOI) FlexfetTM process. This ADC will function to specification and endure in a weapons-level environment. The combination of reliability, high resolution, and high speed suggests a variety of practical applications, including image processing, radar, and communications systems. This work will be done in collaboration with assistance and consultation by American Semiconductor and Arizona State University.

* information listed above is at the time of submission.

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