Radiation Hardening Designs and Techniques for Missile Defense

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0006-07-C-7764
Agency Tracking Number: B063-043-0315
Amount: $99,957.00
Phase: Phase I
Program: SBIR
Awards Year: 2007
Solicitation Year: 2006
Solicitation Topic Code: MDA06-043
Solicitation Number: 2006.3
Small Business Information
6595 North Oracle Road, Suite 153B, Tucson, AZ, 85704
DUNS: 157955597
HUBZone Owned: N
Woman Owned: Y
Socially and Economically Disadvantaged: N
Principal Investigator
 Douglas Goodman
 Principal Investigator
 (520) 742-3300
Business Contact
 Douglas Goodman
Title: President and CEO
Phone: (520) 742-3300
Email: doug@ridgetop-group.com
Research Institution
Together with its supporting partner, Raytheon Missile Systems, the objective of this SBIR proposal is to design a high resolution, high speed 100 MSPS, 14 bit, radiation-hardened Analog-to-Digital Converter (ADC) for critical KEI and Missile applications. This is considered an aggressive goal, since the commercial state-of-the-art ADC is a 12-bit (resolution) 80 MSPS (speed) ADC. However, Ridgetop has developed a unique approach that will meet that goal combining circuit design innovation, with an innovative silicon process. Commercial high performance ADCs are not radiation hardened and may be incapable of reliably operating in the strategic radiation environment for the projected design-life of deployed system. Another benefit, owing to the structure of the Flexfet™ is radiation tolerance. Ridgetop will design a 100 mega sample per second (MSPS), 14-bit ADC, to be manufactured in the American Semiconductor Silicon-on-Insulator (SOI) FlexfetTM process. This ADC will function to specification and endure in a weapons-level environment. The combination of reliability, high resolution, and high speed suggests a variety of practical applications, including image processing, radar, and communications systems. This work will be done in collaboration with assistance and consultation by American Semiconductor and Arizona State University.

* Information listed above is at the time of submission. *

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