Advanced Thermal Management of Very High Power Electronics

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$494,787.00
Award Year:
2004
Program:
STTR
Phase:
Phase II
Contract:
N00014-04-C-0328
Award Id:
65211
Agency Tracking Number:
N033-0218
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
3267 Progress Drive, Orlando, FL, 32826
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
608777798
Principal Investigator:
Daniel Rini
President
(407) 384-7840
dan@rinitech.com
Business Contact:
Daniel Rini
President
(407) 384-7840
dan@rinitech.com
Research Institution:
University of Central Florida
Louis Chow
4000 Central Florida Blvd
Orlando, FL, 32826
(407) 823-3666
Nonprofit college or university
Abstract
The Integrated Power System (IPS) architecture of the Navy's 21st century electric warships will distribute electric power to all shipboard systems including: integrated propulsion plants, crew support, electromagnetic aircraft launching systems, high-power radar and sensors, and high-power electric weapons systems. The IPS will distribute megawatts of power, at high current levels using IGBT modules to switch the power at high frequencies. When these devices operate at high current and frequency they produce heat flux levels that approach 1000 W/cm2. In Phase I, Rini Technologies, Inc. (RTI) demonstrated the feasibility of using their unique evaporative spray cooling (ESC) technique to maintain IGBT junction temperatures of 125¿C when operating at these extreme power levels. In Phase II, RTI engineers and researchers at the UCF will design, fabricate and test a `module level' evaporative spray cooling system to cool a 250 kW IGBT power inverter module. The Phase II prototype will utilize a `cabinet level' architecture to compliment the electronics rack packaging and the ship's zonal level heat removal system. The goal of the Phase II is to demonstrate a TRL-5+ prototype ESC system and establish a clear pathway for qualification and deployment of this technology onto the DD (X) or CVN (X) platforms at the conclusion of Phase III.

* information listed above is at the time of submission.

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