Heat Spreader for High Power Amplifier Device Material Stack-up

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: W9113M-04-P-0099
Agency Tracking Number: B041-039-1477
Amount: $99,986.00
Phase: Phase I
Program: SBIR
Awards Year: 2004
Solicitation Year: 2004
Solicitation Topic Code: MDA04-039
Solicitation Number: 2004.1
Small Business Information
3267 Progress Drive, Orlando, FL, 32826
DUNS: 608777798
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Daniel P Rini
 (407) 384-7840
Business Contact
 Daniel Rini
Title: President
Phone: (407) 384-7840
Email: dan@rinitech.com
Research Institution
We propose to develop a novel cost-effective process to produce carbon nanotube enhanced copper nanocomposites with ultra high thermal conductivity. The process can also tailor the coefficient of thermal expansion (CTE) to match those of all semiconductors. This new nanocomposite is well suited for heat spreading directly under high power RF devices to avoid large temperature gradients. The technique can be also used to produce flow structures such as microchannels for the thermal management of high-voltage GaAs and other WBG power amplifiers that operate at very high power densities. In Phase I, we will demonstrate that the thermal conductivity of the nanocomposite can be more than twice as high as that of copper. While the carbon nanotubes are aligned in the fabrication process, a woven structure can be designed so that the nanocomposite can achieve effective heat spreading in all directions. We will also demonstrate that the CTE of the nanocomposite can be controlled to match those of semiconductors, thus significantly improving the reliability of the radar T/R modules. The effectiveness of this new material as a heat spreader will be demonstrated experimentally. The goal of the overall effort (Phase I and beyond) is to produce a thermal management subsystem that can enhance performance of T/R modules while lowering their production cost.

* Information listed above is at the time of submission. *

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