A Compact, Light-weight, Reliable and Highly Efficient Heat Pump for .

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNJ04JC44C
Agency Tracking Number: 030168
Amount: $99,956.00
Phase: Phase I
Program: STTR
Awards Year: 2004
Solicitation Year: 2003
Solicitation Topic Code: T5.01
Solicitation Number: N/A
Small Business Information
3267 Progress Drive, Orlando, FL, 32826-3230
DUNS: 062473041
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Daniel Rini
 Principal Investigator
 (407) 384-7840
 dan@rinitech.com
Business Contact
 Daniel Rini
Title: Business Official
Phone: (407) 384-7840
Email: dan@rinitech.com
Research Institution
 University of Central Florida
 Not Available
 4000 Central Florida Blvd
Orlando, FL, 32816
 (407) 823-2179
 Domestic nonprofit research organization
Abstract
RTI proposes to develop an efficient, reliable, compact and lightweight heat pump for space applications. The proposed effort is expected to lead to (at the end of Phase II) a microclimate system that can remove 300 Watts of heat (in the cooling mode) requiring 92 Watts of electrical power. In the heating mode, the same system would provide up to 392 Watts of heat. The system is expected to weigh around 3.5 pounds (not including the power source) within a volume of about 1000 cc or 1 L. The design is based on a recently developed portable cooler for the Army. The performance of this system cannot be matched simply by using smaller versions of conventional designs, and is accomplished with recent advances in miniaturization and MEMS. Key technological innovations include use of a Wankel compressor with solid lubricants, system configuration for compact design, and design of condenser and evaporator for microgravity application. Phase I effort will concentrate on thermodynamic cycle, compressor, and solid lubrication. Design of the rest of the system, components and system testing and system integration would be undertaken in Phase II.

* Information listed above is at the time of submission. *

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