High Thermal Conductivity, CTE Matched Heat Spreader with MicroChannel Structures

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: N00178-05-C-3054
Agency Tracking Number: 044-1052
Amount: $99,979.00
Phase: Phase I
Program: SBIR
Awards Year: 2005
Solicitation Year: 2004
Solicitation Topic Code: MDA04-139
Solicitation Number: 2004.4
Small Business Information
RINI TECHNOLOGIES, INC.
3267 Progress Drive, Orlando, FL, 32826
DUNS: 608777798
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Daniel Rini
 President
 (407) 384-7840
 dan@rinitech.com
Business Contact
 Daniel Rini
Title: President
Phone: (407) 384-7840
Email: dan@rinitech.com
Research Institution
N/A
Abstract
Thermal management of radar systems requires the removal of large amounts of waste heat, and in order to maximize the rate of waste heat removal it is critical that the thermal resistance of the heat path be minimized. RTI has successfully developed a nanocomposite material that has a significantly increased thermal conductivity over that of copper and a coefficient of thermal expansion that can be matched to that of semiconductor materials. This material would be ideal for the purposes of reducing thermal resistance and mechanical stresses in the material stack-up of modern and future radar systems. The effort proposed here is to further develop this material and its fabrication process such that nanocomposite structures could be made with internal volumes. These internal volumes could be used to allow for convective heat transfer very near the semiconductor die surface. Bringing the convective heat transfer so close to the T/R module and using a highly thermally conductive material to do so would dramatically reduce the thermal resistance and simultaneously reduce the mechanical stresses at the interface. Therefore, a significant leap in the thermal management of radar systems can be realized.

* information listed above is at the time of submission.

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