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Efficient and Accurate Coupled Circuit and Substrate Simulation for Radiation Hard Electronics

Award Information
Agency: Department of Defense
Branch: Defense Threat Reduction Agency
Contract: HDTRA1-05-P-0116
Agency Tracking Number: T051-001-0178
Amount: $95,831.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: DTRA05-001
Solicitation Number: 2005.1
Timeline
Solicitation Year: 2005
Award Year: 2005
Award Start Date (Proposal Award Date): 2005-08-02
Award End Date (Contract End Date): 2006-01-02
Small Business Information
3512 Kamp Drive
Pleasanton, CA 94588
United States
DUNS: 170882539
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Klas Lilja
 President/CTO
 (925) 577-4692
 klas.lilja@robustchip.com
Business Contact
 Klas Lilja
Title: President/CTO
Phone: (925) 577-4692
Email: klas.lilja@robustchip.com
Research Institution
N/A
Abstract

Robust Chip proposes to develop a unique, new technique to couple circuit simulation and numerical device simulation, for efficient, flexible, and accurate simulation of transient radiation effects at the circuit level. The technique provides the accuracy and flexibility of numerical device simulation for the mobile charge in a semiconductor substrate, combined with the accuracy and speed of compact model simulation for the circuit. It can provide detailed information about the interactions between the circuit, substrate, cell layout and spacing, for radiation effects. This information can be used both for the verification, optimization, and synthesis at the layout level, and also as input for accurate and appropriate models, and modeling techniques, at higher levels in the design hierarchy, as required for successful design automation. In phase 1 the simulation technique will be extended, completed, and implemented into a prototype simulation tool, and accuracy and speed of the method will be verified. Supporting the simulation technique, the generation of a suitable, specialized numerical mesh in the substrate, and the coupling between the mesh and the layout will also be addressed.

* Information listed above is at the time of submission. *

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