Liquid Metal Cluster Ion Source For Repair Of Packaging

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: N/A
Agency Tracking Number: 19691
Amount: $51,045.00
Phase: Phase I
Program: SBIR
Awards Year: 1993
Solitcitation Year: N/A
Solitcitation Topic Code: N/A
Solitcitation Number: N/A
Small Business Information
Si Diamond Technology, Inc.
2435 North Blvd, Houston, TX, 77098
Duns: N/A
Hubzone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Howard K. Schmidt, Phd
 (713) 529-9040
Business Contact
Phone: () -
Research Institution
N/A
Abstract
WE PROPOSE THE DEVELOPMENT OF A DIRECT METAL ETCH AND WRITE (DMEW) TECHNOLOGY BASED ON RECENTLY DEVELOPED LIQUID METAL CLUSTER ION SOURCES (LMCIS) FOR REPAIR OF CONDUCTING PATHS IN POLYCERAMIC SYSTEM. THE LMCIS'S ADVANTAGES OVER COMPETING DIRECT WRITE TECHNOLOGIES INCLUDE HIGH DEPOSITION RATE, NO PRE- OR POST-PROCESSING, GOOD ADHESION AND ALMOST BULK METALLIZATION RESISTIVITY. THIS HIGH THROUGHPUT AND LOCALLIZED DEPOSITION CAPABILITY WILL ENABLE TJIS TECHNOLOGY TO BE USEFUL IN OPTICAL TEST AND REPAIR OF MULTI-LAYER DENSITY INTERCONNECT SUBSTRATES POPULATED MCMs, BARE DIE BUMPING, AND PERSONALIZATION OF SEMI-CUSTOM MCMs. THE OBJECTIVE OF THIS PROJECT DURING PHASE I ARE TO DEMONSTRATE THE FEASIBILITY OF THIS PATENTED AND PROPRIETARY DIRECT WRITE TECHNOLOGY FOR REPAIR OF CONDUCTING PATHS IN POLYCERAMIC SYSTEM. DURING PHASE II, WE WILL DEVELOP A PRODUCTION WORTH DMEW TOOL AND RRELATED PROCESS TECHNOLOGIES FOR METALLIZATION REPAIR.

* information listed above is at the time of submission.

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