High Temperature Packaging Technology for Semiconductors

Award Information
Agency: Department of Defense
Branch: Army
Contract: W31P4Q-06-C-0164
Agency Tracking Number: A052-140-3698
Amount: $69,279.00
Phase: Phase I
Program: SBIR
Awards Year: 2006
Solitcitation Year: 2005
Solitcitation Topic Code: A05-140
Solitcitation Number: 2005.2
Small Business Information
SATCON TECHNOLOGY CORP.
27 Drydock Avenue, Boston, MA, 02210
Duns: 157257502
Hubzone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Leo Casey
 VP and Chief Technology Officer
 (617) 897-2435
 leo.casey@satcon.com
Business Contact
 William O'Donnell
Title: VP, General Manager Applied Tech
Phone: (617) 897-2400
Email: appliedtech.info@satcon.com
Research Institution
N/A
Abstract
SatCon proposes to develop semiconductor packaging technology for the -65/+300°C temperature range. The goal is reliable operation while permitting high device temperature and wide temperature cycles, a particular challenge for existing Power and RF packaging techniques which are suited to the -40/+150°C range. While there are many issues to study further in the Phase I portion of the program, we will build on experience we already have with Wide Band Gap devices and in hi-rel and high-temperature packaging. Our approach is based on: · Minimization of number/types of materials · Use of materials stable at high temperatures · Near-perfect matching of thermal expansions, including :metal conductor layers · Use of multiple parallel die to minimize interface stresses, relative to single large die · Complete elimination of bond wires through use of bump-bonding (flip-chip), compression packaging and other advanced techniques. SatCon has active SiC packaging and applications programs and strong working relationships with the major suppliers (Northrop, Cree & SemiSouth have all endorsed this proposal). We have the facilities, knowledge and personnel to undertake this program through the completion of Phase II and relationships in the Wide Band Gap, Defense and Hi-Rel Industries that will enable us to commercialize the results.

* information listed above is at the time of submission.

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