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Advanced Low-Stress Bonding of Thermally Stable Polycrystalline Diamond Cutters to Tungsten Carbide Substrates

Award Information
Agency: Department of Energy
Branch: N/A
Contract: DE-FG02-96ER82272
Agency Tracking Number: 34558
Amount: $749,968.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Solicitation Year: N/A
Award Year: 1997
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
15 Ward Street
Somerville, MA 02143
United States
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Mr. H. Tracy Hall Jr.
 Senior Research Scientist
 (617) 547-1122
Business Contact
 Dr. Jonah Jacob
Title: President
Phone: (617) 547-1122
Research Institution

Science Research Laboratory

This project will develop a thermally stable polycrystalline diamond cutter than can withstand the higher impact forces and higher cutting temperatures encountered in drilling harder formations with shear bits. A high energy electron beam (HEEB) will be used to braze polycrystalline diamond films to tungsten carbide-cobalt surfaces. This technique is expected to minimize degradation of the two surfaces and eliminate stresses caused by the mismatch in the coefficients of thermal expansion. Phase I will develop the HEEB brazing system, perform preliminary experiments to demonstrate low-stress joining, and determine joint properties. Phase II will be concerned with process optimization, fabrication of sufficient quantities of cutters for laboratory and field use, and qualification of the cutter by bit manufacturers .

Anticipated Results/Potential Commercial Applications as described by the awardee: Application of this technology will allow the use of shear bits in harder formations than hitherto possible. The advanced cutter technology will also be applied to production of advanced diamond bearings for mud motors and gauge protectors for stabilizers and roller-cone bits.

* Information listed above is at the time of submission. *

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