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High-Speed Diagnostic of Temperature and Intensity Variation on Diode-Laser Facets

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: W31P4Q-08-C-0457
Agency Tracking Number: 08ST1-0202
Amount: $98,792.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: ST081-011
Solicitation Number: 2008.A
Solicitation Year: 2008
Award Year: 2008
Award Start Date (Proposal Award Date): 2008-09-22
Award End Date (Contract End Date): 2009-12-15
Small Business Information
United States
DUNS: 106771140
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 (617) 547-1122
Business Contact
 Jonah Jacob
Title: President
Phone: (617) 547-1122
Research Institution
 Joan Kirkendall
25 Buick Street Office of Sponsored Programs
Boston, MA 2215
United States

 (617) 353-4365
 Nonprofit College or University

In this STTR project, Science Research Laboratory (SRL) and Boston University Photonics Center (BU Photonics) will develop a revolutionary optical technology for detecting localized increases in temperature on time scales ranging from nanoseconds to microseconds. By appropriately responding to instabilities in laser diodes (LDs), SRL has demonstrated a 10X increase in their lifetime. Localized diode heating is a critical factor limiting the lifetime of LDs; such heating causes optical and electrical instabilities that damage the emitters and lead to their failure. These instabilities lead to catastrophic optical damage (COD), in which a dramatic temperature increase causes melting in the vicinity of the output facet. In Phase 1 we will obtain electrical and optical data that presage emitter failure. This data will enable SRL to design intelligent electronics that will help protect laser diodes and increase their performance and lifetime. In Phase 2, we will (1) fabricate intelligent fault-protection electronics that are based on the results of Phase 1; (2) demonstrate the improvement in lifetime and performance obtained by protecting; and (3) deliver a prototype of the protection circuit to a facility of DARPA’s choice for additional testing and verification.

* Information listed above is at the time of submission. *

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