High-Speed Diagnostic of Temperature and Intensity Variation on Diode-Laser Facets

Award Information
Agency:
Department of Defense
Amount:
$98,792.00
Program:
STTR
Contract:
W31P4Q-08-C-0457
Solitcitation Year:
2008
Solicitation Number:
2008.A
Branch:
Defense Advanced Research Projects Agency
Award Year:
2008
Phase:
Phase I
Agency Tracking Number:
08ST1-0202
Solicitation Topic Code:
ST081-011
Small Business Information
SCIENCE RESEARCH LABORATORY, INC.
15 WARD STREET, SOMERVILLE, MA, 02143
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
106771140
Principal Investigator
 ALLEN FLUSBERG
 PI
 (617) 547-1122
 aflusberg@srl.com
Business Contact
 Jonah Jacob
Title: President
Phone: (617) 547-1122
Email: jjacob@srl.com
Research Institution
 BOSTON UNIV.
 Joan Kirkendall
 25 Buick Street
Office of Sponsored Programs
Boston, MA, 2215
 (617) 353-4365
 Nonprofit college or university
Abstract
In this STTR project, Science Research Laboratory (SRL) and Boston University Photonics Center (BU Photonics) will develop a revolutionary optical technology for detecting localized increases in temperature on time scales ranging from nanoseconds to microseconds. By appropriately responding to instabilities in laser diodes (LDs), SRL has demonstrated a 10X increase in their lifetime. Localized diode heating is a critical factor limiting the lifetime of LDs; such heating causes optical and electrical instabilities that damage the emitters and lead to their failure. These instabilities lead to catastrophic optical damage (COD), in which a dramatic temperature increase causes melting in the vicinity of the output facet. In Phase 1 we will obtain electrical and optical data that presage emitter failure. This data will enable SRL to design intelligent electronics that will help protect laser diodes and increase their performance and lifetime. In Phase 2, we will (1) fabricate intelligent fault-protection electronics that are based on the results of Phase 1; (2) demonstrate the improvement in lifetime and performance obtained by protecting; and (3) deliver a prototype of the protection circuit to a facility of DARPA’s choice for additional testing and verification.

* information listed above is at the time of submission.

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