Conformable Multichip Assembly Technology

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: N/A
Agency Tracking Number: 36331
Amount: $99,799.00
Phase: Phase I
Program: SBIR
Awards Year: 1997
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
Scientific Systems Company
500 West Cummings Park Suite, 300, Woburn, MA, 01801
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Charles W. Eichelberger
 (617) 932-7870
Business Contact
Phone: () -
Research Institution
EPIC Technologies proposes to develop a flexible high density multichip assembly technology capable of being bent and twisted to conform to the available space in a constrained military of commercial electronic system. EPIC will adapt its basic chips first multichip assembly technology to meet the requirements of a conformable assembly. EPIC's basic chip first technology has been previously developed and is now being used to produce fieldable portable systems. The technology comprises a high density additive printed circuit technology applied to a substrate containing bare integrated circuit chips. The main goal of the Phase I effort is to demonstrate the feasibility of the conformable technology by producing a prototype. This prototype will consist of existing passive chips which can be connected into daisy chains in the conformable assembly. Prototypes will be designed, fabricated, tested, subjected to bending and torsional stress and retested to confirm the reliability of the connections.A second goal of the Phase I effort is to identify military and commercial applications of the conformable technology. This will be accomplished by reviewing the forthcoming capability with government and commercial entities during Phase I.

* information listed above is at the time of submission.

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