500?C SiC JFET Driver Circuits and Packaging

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNC05CA84C
Agency Tracking Number: 042191
Amount: $69,979.00
Phase: Phase I
Program: SBIR
Awards Year: 2005
Solicitation Year: 2004
Solicitation Topic Code: S4.02
Solicitation Number: N/A
Small Business Information
SemiSouth Laboratories, Inc
201 Research Blvd., Starkville, MS, 39759-7704
DUNS: 622392111
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Jeffrey Casady
 Principal Investigator
 (662) 324-7607
 jeff.casady@semisouth.com
Business Contact
 Jeffrey Casady
Title: President & CTO
Phone: (662) 324-7607
Email: jeff.casady@semisouth.com
Research Institution
N/A
Abstract
In the proposed development, SiC JFET control circuitry and normally-off SiC JFET power switch will be integrated in a single SiC chip that will provide digital output for driving piezoelectric, electrostatic, or electromagnetic actuators. Innovative device design, metallurgical ohmic contact and die attach development, and coordinated packaging approaches will result in SiC power I.C. technology capable of sustained operation at 465?C, an industry first. This development will result in a unique lightweight, low-cost, packaged all-SiC Smart Power Module able to reliably operate in extremely high temperature, pressure, and radiation environments. Silicon carbide active components (vertical SemiSouth SiC power transistors) will be evaluated for 465C ambient operation. Improvements in the metallurgical ohmic contacts, die attach, wire bond, and package will be investigated to extend the reliable operating temperature range. Additionally, passive components such as thick film resistors, NPO and diamond capacitors, will be investigated as well. Finally, all of this information will be used to develop compact device and circuit models to propose a complete packaged commercial solution for 500C capable SiC based driver circuits.

* information listed above is at the time of submission.

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