STTR Phase I: An Unique, Low-Cost, Real-Time Mold Detector

Award Information
Agency:
National Science Foundation
Branch
n/a
Amount:
$99,998.00
Award Year:
2003
Program:
STTR
Phase:
Phase I
Contract:
0319303
Agency Tracking Number:
0319303
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Sensor Development Corporation
3449 Delmar Drive, Rocky River, OH, 44116
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Nicholas Smilanich
() -
Business Contact:
() -
Research Institution:
University of South Dakota

414 East Clark Street
Vermillion, SD, 57069

Nonprofit college or university
Abstract
This Small Business Technology Transfer (STTR) Phase I project proposes to produce an infrared photo-elastic stress analysis system utilizing cutting edge technology analogous to visible light photo-elasticity and applied for the first time to optically opaque, yet infrared transparent, materials. The device will allow nondestructive, full-field stress characterization of silicon, compound semi-conductors, photonic materials, thin films, interfaces, and buried layers at a speed applicable to on-line inspection. Currently, residual stresses are not routinely measured because there are no efficient commercially available techniques. The result of Phase I will be an industrially driven design criteria for an instrument that can measure these residual stresses in a manner that is rapid, affordable, easy to master, and easy to justify. A prototype stress imager will find applications in nearly every portion of the micro-electronics industry including; wafer manufacture, device manufacture, microelectronics packaging, and MEMS devices. The proposed instrument will be relatively inexpensive, affordable enough for small universities, fabs, and engineering mechanics laboratories. Finally, commercial applications outside the electronics industry have been identified, including; inspecting thermal barrier coatings, measuring sintering stresses in ceramics as well as curing stresses in polymers and polymer composites.

* information listed above is at the time of submission.

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