Development of On-Demand Non-Polar and Semi-Polar Bulk Gallium Nitride Materials for Next Generation Electronic and Optoelectronic Devices

Award Information
Agency: Department of Defense
Branch: Army
Contract: W911NF-06-C-0134
Agency Tracking Number: A064-019-0362
Amount: $99,815.00
Phase: Phase I
Program: STTR
Awards Year: 2006
Solicitation Year: 2006
Solicitation Topic Code: A06-T019
Solicitation Number: N/A
Small Business Information
SENSOR ELECTRONIC TECHNOLOGY, INC.
1195 Atlas Road, Columbia, SC, 29209
DUNS: 135907686
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Qhalid Fareed
 (803) 647-9757
 fareed@s-et.com
Business Contact
 Remis Gaska
Title: President and CEO
Phone: (803) 647-9757
Email: gaska@s-et.com
Research Institution
 UNIV. OF SOUTH CAROLINA
 Asif Khan
 301 South Main Street
Columbia, SC, 29208
 (803) 777-7941
 Nonprofit college or university
Abstract
GaN-based electronic and optoelectronic devices have demonstrated superior properties for applications involving visible and ultraviolet light emitting diodes (LEDs), laser diodes, and high-power electronic devices. Despite the significant improvement in the performance of these devices, they still suffer from strong built-in electrostatic field due to spontaneous and piezoelectric polarizations, and high defect density and biaxial strain due to the heteroepitaxial growth on foreign substrates, both being undesirable in the operation of devices. In response, Sensor Electronic Technology, Inc. has defined a novel approach for producing free-standing low-defect density non-polar a-plane GaN substrates suitable for the growth of the next generation of devices. Thick a-plane GaN boules will be grown by a combination of growth processes, including selective area lateral epitaxy (SALE) and HVPE, which will lead to defect densities below 107 cm-2. SALE will provide low-defect smooth templates for subsequent thick boule growth by modified HVPE. SALE templates will help in preventing cracking and bowing of the wafers.

* information listed above is at the time of submission.

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