Low-Power, Monolithically Printed, Conformal, Sensors and Associated Microelectronics

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: DAAH0103CR223
Agency Tracking Number: 03SB1-0282
Amount: $98,999.00
Phase: Phase I
Program: SBIR
Awards Year: 2003
Solitcitation Year: N/A
Solitcitation Topic Code: N/A
Solitcitation Number: N/A
Small Business Information
SI2 TECHNOLOGIES
200 Turnpike Road, Chelmsford, MA, 01824
Duns: 131640919
Hubzone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Joseph Kunze
 Principal Investigator
 (978) 856-4162
 Jkunze@tritonsys.com
Business Contact
 Ross Haghighat
Title: CEO
Phone: (978) 856-4148
Email: Rhaghighat@tritonsys.com
Research Institution
N/A
Abstract
SI2 Technologies, Inc. (SI2) proposes the use of high mobility (>10 cm2/(V s)) organic semiconductors to enable printable, low-power flexible sensors and microelectronics with the compactness and low weight that is essential for manned and unmanned aerialvehicle (UAV) electronic system integration. SI2's Direct Write technology and high mobility conductive polymers enable the proposed sensor systems and will offer a significant cost reduction over the existing paradigm. By reducing the cost of electronicdevices and using large area flexible substrates, it is possible to distribute the electronics over the entire surface of a vehicle and provide an additional saving of space over conventionally packaged electronic devices. The proposed low powermicroelectronic system will increase the mission capability of a number of military platforms such as UAV's. The ability to cost effectively embed and integrate microelectronics will provide additional capabilities with minimal space, weight and powerrequirements. Additionally, the ability to fabricate inexpensive sensors conformal with vehicle surfaces could greatly increase the ease of which chemical and biological agents can be detected. This ability could have a wide range of applicationincluding homeland defense. This technology also has potential in the commercial sector for a embedded sensors, logic and communications systems where cost, space, weight and power are constrained.

* information listed above is at the time of submission.

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