A Reliable Aluminum Nitride High Temperature Electronic Package for High Power Devices
Small Business Information
19501 144th Avenue NE, Suite F-500, Woodinville, WA, 98072
AbstractThis Small Business Innovation Research Phase I project will develop an AlN ceramic package that will facilitate the operation of high power SiC devices at temperatures greater than 300ÂºC. Processes to assemble the components into a hermetically sealed package will be identified and developed. We will develop a novel die attach to overcome thermal stress failures, and a robust monometallic gold wire bonding capable of reliable operation above 300ÂºC possibly up to 600ÂºC. Test vehicles will be fabricated and used to evaluate the high temperature stability of the material systems to be used in the package construction.
* information listed above is at the time of submission.