A Reliable Aluminum Nitride High Temperature Electronic Package for High Power Devices

Award Information
Agency:
Department of Defense
Branch
Army
Amount:
$120,000.00
Award Year:
2006
Program:
SBIR
Phase:
Phase I
Contract:
W31P4Q-06-C-0153
Award Id:
78569
Agency Tracking Number:
A052-140-3695
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
19501 144th Avenue NE, Suite F-500, Woodinville, WA, 98072
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
015577190
Principal Investigator:
EnderSavrun
President
(425) 485-7272
ender.savrun@siennatech.com
Business Contact:
CananSavrun
Vice President
(425) 485-7272
canan.savrun@siennatech.com
Research Institute:
n/a
Abstract
This Small Business Innovation Research Phase I project will develop an AlN ceramic package that will facilitate the operation of high power SiC devices at temperatures greater than 300ºC. Processes to assemble the components into a hermetically sealed package will be identified and developed. We will develop a novel die attach to overcome thermal stress failures, and a robust monometallic gold wire bonding capable of reliable operation above 300ºC possibly up to 600ºC. Test vehicles will be fabricated and used to evaluate the high temperature stability of the material systems to be used in the package construction.

* information listed above is at the time of submission.

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