A Reliable Aluminum Nitride High Temperature Electronic Package for High Power Devices

Award Information
Agency: Department of Defense
Branch: Army
Contract: W31P4Q-06-C-0153
Agency Tracking Number: A052-140-3695
Amount: $120,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2006
Solicitation Year: 2005
Solicitation Topic Code: A05-140
Solicitation Number: 2005.2
Small Business Information
SIENNA TECHNOLOGIES, INC.
19501 144th Avenue NE, Suite F-500, Woodinville, WA, 98072
DUNS: 015577190
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Ender Savrun
 President
 (425) 485-7272
 ender.savrun@siennatech.com
Business Contact
 Canan Savrun
Title: Vice President
Phone: (425) 485-7272
Email: canan.savrun@siennatech.com
Research Institution
N/A
Abstract
This Small Business Innovation Research Phase I project will develop an AlN ceramic package that will facilitate the operation of high power SiC devices at temperatures greater than 300ºC. Processes to assemble the components into a hermetically sealed package will be identified and developed. We will develop a novel die attach to overcome thermal stress failures, and a robust monometallic gold wire bonding capable of reliable operation above 300ºC possibly up to 600ºC. Test vehicles will be fabricated and used to evaluate the high temperature stability of the material systems to be used in the package construction.

* information listed above is at the time of submission.

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