A Reliable Electronic Package for Space Exploration

Award Information
Agency:
National Aeronautics and Space Administration
Branch
n/a
Amount:
$100,000.00
Award Year:
2008
Program:
SBIR
Phase:
Phase I
Contract:
NNX08CC74P
Award Id:
88119
Agency Tracking Number:
075216
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
19501 144th Avenue NE, Suite F-500, Woodinville, WA, 98072
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
015577190
Principal Investigator:
EnderSavrun
Principal Investigator
(425) 485-7272
ender.savrun@siennatech.com
Business Contact:
EnderSavrun
Business Official
(425) 485-7272
ender.savrun@siennatech.com
Research Institute:
n/a
Abstract
The proposed program will develop an hermetic, CTE matched, thermal shock resistant ceramic packaging technology that will facilitate the operation of Si and SiGe devices at extreme temperatures (-230ýýC to 130ýýC) encountered on the Moon and Mars. Processes to assemble the components into a hermetically sealed package will be identified and developed. Process and materials capability will be demonstrated by fabricating and testing a 12 or 28 pin single chip module test vehicle.

* information listed above is at the time of submission.

Agency Micro-sites


SBA logo

Department of Agriculture logo

Department of Commerce logo

Department of Defense logo

Department of Education logo

Department of Energy logo

Department of Health and Human Services logo

Department of Homeland Security logo

Department of Transportation logo

Enviromental Protection Agency logo

National Aeronautics and Space Administration logo

National Science Foundation logo
US Flag An Official Website of the United States Government