A Reliable Electronic Package for Space Exploration

Award Information
Agency:
National Aeronautics and Space Administration
Branch
n/a
Amount:
$100,000.00
Award Year:
2008
Program:
SBIR
Phase:
Phase I
Contract:
NNX08CC74P
Agency Tracking Number:
075216
Solicitation Year:
2007
Solicitation Topic Code:
X1.03
Solicitation Number:
n/a
Small Business Information
Sienna Technologies, Inc.
19501 144th Avenue NE, Suite F-500, Woodinville, WA, 98072-4423
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
015577190
Principal Investigator:
Ender Savrun
Principal Investigator
(425) 485-7272
ender.savrun@siennatech.com
Business Contact:
Ender Savrun
Business Official
(425) 485-7272
ender.savrun@siennatech.com
Research Institution:
n/a
Abstract
The proposed program will develop an hermetic, CTE matched, thermal shock resistant ceramic packaging technology that will facilitate the operation of Si and SiGe devices at extreme temperatures (-230ºC to 130ºC) encountered on the Moon and Mars. Processes to assemble the components into a hermetically sealed package will be identified and developed. Process and materials capability will be demonstrated by fabricating and testing a 12 or 28 pin single chip module test vehicle.

* information listed above is at the time of submission.

Agency Micro-sites

US Flag An Official Website of the United States Government