A Reliable Electronic Package for Space Exploration

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNX08CC74P
Agency Tracking Number: 075216
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2008
Solicitation Year: 2007
Solicitation Topic Code: X1.03
Solicitation Number: N/A
Small Business Information
Sienna Technologies, Inc.
19501 144th Avenue NE, Suite F-500, Woodinville, WA, 98072-4423
DUNS: 015577190
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Ender Savrun
 Principal Investigator
 (425) 485-7272
 ender.savrun@siennatech.com
Business Contact
 Ender Savrun
Title: Business Official
Phone: (425) 485-7272
Email: ender.savrun@siennatech.com
Research Institution
N/A
Abstract
The proposed program will develop an hermetic, CTE matched, thermal shock resistant ceramic packaging technology that will facilitate the operation of Si and SiGe devices at extreme temperatures (-230ºC to 130ºC) encountered on the Moon and Mars. Processes to assemble the components into a hermetically sealed package will be identified and developed. Process and materials capability will be demonstrated by fabricating and testing a 12 or 28 pin single chip module test vehicle.

* information listed above is at the time of submission.

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