Development of Dielectric Films for Wound Capacitors

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$69,963.00
Award Year:
2008
Program:
SBIR
Phase:
Phase I
Contract:
N00014-08-M-0188
Award Id:
87606
Agency Tracking Number:
N081-076-0308
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
10960 N. Stallard Place, Tucson, AZ, 85737
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
787636778
Principal Investigator:
GordonGoodyear
R&D Manager
(520) 575-8013
ggoodyear@sigmalabs.com
Business Contact:
DorisDziomba
Administration Manager
(520) 575-8013
ddziomba@sigmalabs.com
Research Institute:
n/a
Abstract
This proposal addresses the development a high dielectric constant polymer films that will be used to produce self healing high energy density capacitors. The polymer dielectric is produced using a non contact method which results in defect-free, high temperature polymers that have an amorphous structure, high breakdown strength and low dielectric absorption. The complete metalized capacitor film will be produced in a one step roll to roll process with no handling or contact between the polymer formation and metallization steps. The polymer dielectrics can be formulated with a wide range of dielectric constants and thicknesses ranging from 100nm to 10+μm. The proposed development will focus in the formulation of polymer dielectrics with high dielectric constants which have been shown to have superior self healing properties, higher temperature capability and breakdown strength than conventional metalized film dielectrics. The capacitor film production process will incorporate a unique step that allows the formation of very thin corrosion stable, heavy edge electrodes, which are necessary for producing high energy density metalized capacitors. The phase one program will focus in evaluating the energy density of capacitors with high k polymers and different dielectric thickness. Deliverables will include 1ftx1ft capacitors and parametric data such as capacitance and dissipation factor as a function of temperature, dielectric absorption, energy density, and dV/dt charge and discharge characteristics.

* information listed above is at the time of submission.

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