ADVANCED PACKAGING ASSEMBLY FOR VLSI DEVICES

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N/A
Agency Tracking Number: 4377
Amount: $494,000.00
Phase: Phase II
Program: SBIR
Awards Year: 1987
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
493 E 6th St - Ste A, Tracy, CA, 95376
DUNS: N/A
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Jon M Schroeder
 (209) 836-1555
Business Contact
Phone: () -
Research Institution
N/A
Abstract
PRESENTLY THERE ARE MANY PROBLEMS WITH THE AVAILABLE IN THE MARKET. THIS RESEARCH PROJECT PROPOSES A VLSI PACKAGING SYSTEM WHICH CAN PROVIDE ENHANCED THERMAL MANAGEMENT BECAUSE OF THE USE OF SPUTTERED ALUMINUM NITRIDE, COPPER CLAD INVAR CORE MATERIAL IN THE SUBSTRATE AND TAB TECHNOLOGY. THE PACKAGING SYSTEM ALSO ENHANCES THE ELECTRICAL CHARACTERISTICS OF THE VLSI DEVICES BECAUSE OF AN INTEGRATED DECOUPLING CAPACITOR AND TAB BONDING. OTHER ADVANTAGES OF THE SYSTEM ARE COST REDUCTION, HIGH RELIABILITY AND GREATER STRUCTURAL STRENGTH. FIVE EMERGING TECHNOLOGIES ARE USED IN THE SYSTEM: COPPER CLAD INVAR CORE MATERIAL, TAB BONDING, SPUTTERED ALUMINUM NITRIDE, GLASS BEADED KOVAR AND THIN FILM HERMETIC SEALING. THE RESEARCH PLAN CALLS FOR DESIGN, DEVELOP, PROTOTYPE TESTING, EVALUATION AND ASSESSMENT OF THE SYSTEM. THE TEST PLAN USES BOTH MIL SPEC AND SPECIAL TESTING.

* Information listed above is at the time of submission. *

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