Rad Effects in Semiconductor Electronics

Award Information
Agency: Department of Defense
Branch: Defense Threat Reduction Agency
Contract: HDTRA1-05-P-0107
Agency Tracking Number: T051-001-0073
Amount: $99,994.00
Phase: Phase I
Program: SBIR
Awards Year: 2005
Solicitation Year: 2005
Solicitation Topic Code: DTRA05-001
Solicitation Number: 2005.1
Small Business Information
3620 Lost Creek Boulevard, Austin, TX, 78735
DUNS: 147671957
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Wesley Morris
 (512) 891-9702
Business Contact
 Jon Gwin
Title: Director
Phone: (210) 822-9706
Email: jgwin@siliconspacetech.com
Research Institution
Silicon Space Technology and team member ATK Mission Research, along with Jazz Semiconductor, propose to demonstrate a comprehensive methodology for TCAD simulation using leading-edge Synopsys tools. These tools are capable of 3-D process and device simulation, enabling Mixed-Mode simulations studies of radiation particles with silicon devices and their response to the circuit. We will collaborate with Jazz Semiconductor to calibrate their CA18 CMOS process in 2-D and 3-D simulations. We will predict and describe accurately the transistor device performance to variations in channel size and/or to the process. Calibrated Mixed-Mode simulations will be more accurate in describing the results of single event effects. Given the availability of silicon foundry bulk CMOS technology, it would be advantageous if a comprehensive modeling approach based on the actual foundry process were available to predict or quantify its radiation sensitivity. We propose to demonstrate this is possible using commercially available process and device simulation tools that can be combined with SPICE simulation tools to perform Mixed-Mode simulations. The Mixed-Mode simulation methodology can then be embedded within the fabric of a commercially available TCAD modeling environment tool and used to quantify and predict the radiation sensitivity of the foundry process.

* information listed above is at the time of submission.

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