Radiation Hard Electronic Components (Sierra)

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$99,938.00
Award Year:
2006
Program:
SBIR
Phase:
Phase I
Contract:
W9113M-06-C-0111
Agency Tracking Number:
053-0265
Solicitation Year:
2005
Solicitation Topic Code:
MDA05-029
Solicitation Number:
2005.3
Small Business Information
SILICON SPACE TECHNOLOGY CORP.
3620 Lost Creek Boulevard, Austin, TX, 78735
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Wesley Morris
President
(512) 891-9702
wmorris@siliconspacetech.com
Business Contact:
Jon Gwin
COO
(210) 822-9706
jgwin@siliconspacetech.com
Research Institution:
n/a
Abstract
Silicon Space Technology (with Harris and LSI Logic) proposes to demonstrate innovative RH enhancement of an ASIC component, using improved RH manufacturing technologies, capable of reliable operation in the BMDS for its projected mission life. Specifically, we will develop a scaleable Sierra II Cryptographic Processor using 180 nm technology enhanced by SEE and TID mitigation process modules supporting radiation-hardening of components fabricated in commercial silicon foundries. Extensive modeling and simulation will demonstrate performance and radiation hardness in Phase I. Our team's expertise in commercial process integration, device development in leading-edge commercial technology, and radiation-hardening techniques using HBP technology is crucial to successful implementation of the radiation-hardened process modules. Silicon Space's HBI approach, combined with leading-edge silicon foundry manufacturing, creates a practical means to develop digital and analog electronic components capable of reliable operation in BMDS space and interceptor environments. The goal is achieving near-current-commercial product performance capable of surviving SEE and TID. This program will allow rapid transition of the results into systems and subsystems being developed for the BMDS. Leading-edge CMOS foundries producing these products will achieve the previously unattainable goal of deploying the latest electronics while minimizing risk of mission failure due to space radiation.

* information listed above is at the time of submission.

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