Radiation Hard Electronic Components (DSP)

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: W9113M-07-C-0058
Agency Tracking Number: B063-042-0471
Amount: $99,997.00
Phase: Phase I
Program: SBIR
Awards Year: 2007
Solitcitation Year: 2006
Solitcitation Topic Code: MDA06-042
Solitcitation Number: 2006.3
Small Business Information
SILICON SPACE TECHNOLOGY CORP.
3620 Lost Creek Boulevard, Austin, TX, 78735
Duns: 147671957
Hubzone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Wesley Morris
 President
 (512) 891-9702
 wmorris@siliconspacetech.com
Business Contact
 Jon Gwin
Title: COO
Phone: (210) 822-9706
Email: jgwin@siliconspacetech.com
Research Institution
N/A
Abstract
Silicon Space Technology (SST), working with Texas Instruments (TI), proposes to demonstrate an innovative approach for converting a high-performance COTS DSP circuit (radiation-soft) to a radiation-hardened circuit by integrating two new process modules into the commercial process. Silicon Space has solved the major space radiation problems, Single-Event Effects (SEE) and Total Ionizing Dose (TID), by combining process modifications and layout design innovation. Our proven-in-silicon approach enables production of radiation-hardened integrated circuits at leading-edge circuit densities within any commercial silicon foundry, for use in both terrestrial and space systems. A sequence of radiation tests have shown SST’s Buried Guard Ring (BGR) innovation significantly improves SEE performance (e.g., SEL, SET, & SEU). BGR also significantly improves dose rate performance by >1.5 orders of magnitude higher than non-BGR protected circuits. SST’s Parasitic Isolation Device (PID) structures have shown complete TID immunity to > 1Mrad. These methods do not adversely affect either circuit performance or yield. SST will demonstrate a procedure for integrating BGR and PID into an existing TI commercial DSP product. This Phase I effort, when demonstrated in Phase II silicon experiments, will enable manufacture of radiation-hardened DSP’s which exceed MDA’s required levels of radiation performance.

* information listed above is at the time of submission.

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