SBIR Phase I: Nanoporous Silica Slurry Technology for Enhanced Chemical Mechanical Planarization (CMP) of Low "k" Dielectrics

Award Information
Agency:
National Science Foundation
Branch
n/a
Amount:
$99,938.00
Award Year:
2003
Program:
SBIR
Phase:
Phase I
Contract:
0232709
Award Id:
62765
Agency Tracking Number:
0232709
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
2153 Hawthorne Rd, Gainesville, FL, 32641
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Deepika Singh
() -
Business Contact:
() -
Research Institute:
n/a
Abstract
The Small Business Innovation Research (SBIR) Phase I project will synthesize novel slurries for chemical mechanical planarization (CMP) of low dielectric constant (K) materials. Standard abrasives such as silica and alumina lead to significant scratching, indenting and delamination of the soft low K surface. In this project it is proposed to use nanoporous silica based slurries in which the hardness of the particle can be controlled. In the project, synthesis of nanoporous silica particles will first be carried out followed by charcterization; next will be development of the slurry formulation followed by charcterization and finally testing against the specific needs of the CMP application. Commercially, these slurries are expected to reduce surface defects and enhance slurry stability. It is expected that major electronic manufacturing companies will use this new type of slurry. Wafer level experiments are already planned on patterned wafers in collaboration with key industrial partners.

* information listed above is at the time of submission.

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