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SBIR Phase I: Abraisve Free Chemical Mechanical Planarization (AFCMP) Process for Next Generation Copper Interconnects

Award Information
Agency: National Science Foundation
Branch: N/A
Contract: 0712037
Agency Tracking Number: 0712037
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: EL
Solicitation Number: NSF 06-598
Solicitation Year: 2006
Award Year: 2007
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
2153 SE HAWTHORNE RD STE 129 Suite 190
United States
DUNS: 024935517
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: No
Principal Investigator
 Abhudaya Mishra
 (352) 334-7237
Business Contact
 Abhudaya Mishra
Title: PhD
Phone: (352) 334-7237
Research Institution

This small business innovation research (SBIR) Phase I project proposes the development of a novel abrasive-free recyclable copper CMP (AFCMP) recyclable process based on an unique patented iodine chemistry which leads to the formation of a soft, insoluble copper iodide layer on the surface of the copper. This layer can be gently removed by the polishing pad without the need for particles in the slurry (abrasive-free slurry). This process is in contrast to conventional CMP processes that forms a hard copper oxide layer (by addition of hydrogen peroxide), which require both etching chemicals and hard abrasives (alumina/silica) for removal. In contrast, the copper iodide layer possess nearly an order of magnitude less hardness, thus can be easily removed by the polymer polishing pad. The insoluble copper-iodide in the effluents can be removed by filtration and the chemicals can be recycled back for CMP polishing. This project will attempt successful demonstration of (i) copper polishing using abrasive-free CMP slurries to meet present technical requirements, (ii) compatibility of AFCMP slurries to next generation ultra-low k dielectrics materials, (iii) the ability to filter and obtain consistent performances with the filtrate slurries. The rapid integration of low k interconnects and AFCMP is expected to lead to substantial profits and energy savings. Environmental friendly manufacturing, and increase in hi-tech jobs. US will be a leader in copper low k CMP technology; and US based semiconductor companies will have a local slurry supplier. Ensure US leadership in nanotechnology.

* Information listed above is at the time of submission. *

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