A Single Event Upset Immune Re-Programmable FPGA Utilizing a Commercial Architecture

Award Information
Agency:
Department of Defense
Branch
Defense Threat Reduction Agency
Amount:
$100,000.00
Award Year:
2003
Program:
SBIR
Phase:
Phase I
Contract:
DTRA01-03-P-0181
Award Id:
63558
Agency Tracking Number:
T031-0163
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Suite 103, 201 Circle Drive, Piscataway, NJ, 08854
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
787144807
Principal Investigator:
Joseph Cuchiaro
VP Business Development
(732) 885-5909
jcuchiaro@aol.com
Business Contact:
Gary Tompa
President
(732) 885-5909
gstompa@aol.com
Research Institution:
n/a
Abstract
Radiation tolerant Field Programmable Gate Arrays (FPGA's) have gained wide and rapid acceptance by military and aerospace equipment suppliers; however, there are presently a limited number of chip-sets available for production. The lack of FPGAalternatives severely limits the range of available functions and applications that would greatly benefit from increased performance with radiation hardness. Further, FPGA technology that can be produced from common mass production techniques is highlysought after for significant cost savings on a per unit basis. We propose to use our newly invented radiation tolerant high temperature non-linear dielectric to develop a Single Event Upset (SEU) immune re-programmable and nonvolatile logic device, asmall FPGA, that is immune to SEU events. In Phase I we will show proof of our high temperature non-linear dielectric proof of concept and in Phase II we will optimize the technology for prototype demonstration in a commercial manufacturing environmentusing common mass production techniques, and demonstrate packaged device functionality for use in radiation environments. Phase III will be product introduction to the military and commercial space markets. A ferroelectric Field Re-Programmable Gate Arrayhas significant potential to replace existing

* information listed above is at the time of submission.

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