CMOS Compatible Active Silicon Nanophotonic Devices and Systems

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$750,000.00
Award Year:
2005
Program:
STTR
Phase:
Phase II
Contract:
FA9550-05-C-0166
Award Id:
67931
Agency Tracking Number:
F045-013-0141
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
201 Circle Drive North, Unit # 102, Piscataway, NJ, 08854
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
787144807
Principal Investigator:
Brent Hoerman
Scientist
(732) 302-9274
bhoerman@structuredmaterials.com
Business Contact:
Gary Tompa
President
(732) 302-9274
gstompa@structuredmaterials.com
Research Institution:
CORNELL UNIV.
Mora Harris
117 Day Hall
Ithica, NY, 14853
(607) 255-1050
Nonprofit college or university
Abstract
In this STTR effort, Structured Materials Industries, Inc. (SMI), in collaboration with our academic and industrial partners will design, develop, and demonstrate a more efficient and compact, silicon optical modulator based on nanoscale photonic structures that is completely compatible with standard CMOS processing. The structures developed will form the building blocks for a family of devices based on active silicon nanophotonics which will open the door to a new technology free from conventional microelectronics limitations, providing low power, high bandwidth, high speed and ultra-small optoelectronic components. Moreover, the active silicon nanophotonic devices to be developed will benefit from the inherent infrastructure and cost benefits of the existing CMOS manufacturing infrastructure. In Phase I of this project, we expanded preliminary results on specific electro-optic devices to address a more general class of devices and their integration on a silicon chip within a commercially manufacturable infrastructure. In this Phase II effort we will complete development of the devices and finalize a route for integrating passive and active components into complex, electro-optical systems on a single silicon chip within a commercial CMOS foundry.

* information listed above is at the time of submission.

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