Electro-Optically Activated, Si-Based Laser for All-Optic Integrated Systems

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA9550-05-C-0102
Agency Tracking Number: F054-013-0377
Amount: $100,000.00
Phase: Phase I
Program: STTR
Awards Year: 2005
Solicitation Year: 2005
Solicitation Topic Code: AF05-T013
Solicitation Number: N/A
Small Business Information
201 Circle Drive North, Unit # 102, Piscataway, NJ, 08854
DUNS: 787144807
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Brent Hoerman
 (732) 302-9274
Business Contact
 Gary Tompa
Title: President
Phone: (732) 302-9274
Email: gstompa@structuredmaterials.com
Research Institution
 Vicki Dan
 120 Day Hall
Ithaca, NY, 14853
 (607) 255-5014
 Nonprofit college or university
In this STTR effort, Structured Materials Industries, Inc. (SMI), in collaboration with our academic and industrial partners will design, develop, and demonstrate an electro-optically activated, silicon-based laser based on specially designed nanoscale photonic structures. The technology to be developed and matured in this effort will overcome the main limitations to realization of the high-density integrated-optic circuits required for chip-scale photonic networks in silicon -- achieving a practical Si based laser. Importantly, our approach includes the fundamental ability to be electrically pumped, a key requirement for truly unleashing the promise of silicon photonics. Moreover, the structures developed under this program will form the building blocks for a family of devices based on active silicon nanophotonics, thereby providing low power, high bandwidth, high speed and ultra-small optoelectronic components to several markets. In Phase I of this project, we propose to expand our fabrication of preliminary nanoscale cavity devices to address the development of an electronically driven laser on a silicon chip. In Phase II we will complete development of the devices and finalize a route for integrating passive and active components into complex, electro-optical systems on a single silicon chip.

* Information listed above is at the time of submission. *

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