Radiation Hard Nonvolatile Chalcogenide-based Memories

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$100,000.00
Award Year:
2005
Program:
SBIR
Phase:
Phase I
Contract:
HQ0006-05-C-7182
Award Id:
74621
Agency Tracking Number:
044-1665
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
STRUCTURED MATERIALS INDUSTRIES (Currently Structured Materials Industries, Inc.)
Suite 103, 201 Circle Drive, Piscataway, NJ, 08854
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
787144807
Principal Investigator:
Edwin Dons
Scientist
(732) 302-9274
emd0138@njit.edu
Business Contact:
Gary Tompa
President
(732) 302-9274
gstompa@structuredmaterials.com
Research Institution:
n/a
Abstract
Structured Materials Industries, Inc. (SMI), in collaboration with BAE SYSTEMS, will develop and demonstrate an improved production technology for chalcogenide-based nonvolatile memories using MOCVD. The goal of this project is to fabricate and test alloyed and doped, chalcogenide Ge2Sb2Te5 test structures grown by MOCVD for subsequent incorporation in standard CMOS process technology. In addition, we will develop a process and production tool model that will ultimately lead to improved manufacturability of these devices. This work will build on the current, joint efforts of SMI - a US leader in cutting-edge MOCVD technology - and BAE SYSTEMS - a worldwide leader in CMOS compatible, chalcogenide-based nonvolatile memory - to bring this technology to a manufacturable state. CMOS compatible chalcogenide-based nonvolatile memory technology exceeds the best features of current state-of-the-art SONOS technology without the inherent degradation and endurance limitations. The use of MOCVD affords sub-nm growth control and a proven production capability that promises to lead to improved device properties and thus, improved yield and product quality. For these reasons, SMI and BAE SYSTEMS are ideally suited to develop and commercialize this technology.

* information listed above is at the time of submission.

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