A Heterointegrated InGaAs 40Gb Optoelectronic Cross Bar Receiver E- IR (>0.9 microns)

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$72,622.00
Award Year:
2002
Program:
SBIR
Phase:
Phase I
Contract:
F19628-02-C-0072
Agency Tracking Number:
02-0988
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Solid State Scientific Corp.
27-2 Wright Road, Hollis, NH, 03049
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
006591721
Principal Investigator:
William Clark
Principal Investigator
(603) 465-5686
billc@solidstatescientific.com
Business Contact:
Linda Bouthillette
Contract Administrator
(603) 465-5686
linda@solidstatescientific.com
Research Institution:
n/a
Abstract
"Advances in EO sensors and fiber optic information distribution systems havesimplified the distribution of targeting information among the varioussystems. The requirements for higher levels of functionality and performanceare pushing the levels of integration to a point that can no longer besatisfied by the industry mainstay approach of hybrid assembly. Significantimprovements in fiber-optic systems and EO sensors can be gained at thecomponent and packaging levels. Solid State Scientific Corporation (SSSC)has developed an integration technique, Epitaxial Layer Transfer (ELT),which eliminates many limitations of optoelectronic component integration,allowing the direct fabrication of optical devices on foundry-processedsemiconductor wafers. SSSC proposes to demonstrate the potential of the ELTprocess in this Phase I program by integrating arrays of InGaAsphotodetectors with foundry processed high-performance transistoramplifiers. This will be the first demonstration of the ELT technology onthe high-speed circuits. The goal for Phase 2 is a fully integrated32-channel Reconfigurable Optoelectronic Cross Bar Receiver operating at 40Gb/s for next generation WDM optical fiber communications. Industries that will benefit from these technologies include military, telecom/datacom, and automotive. Aside from the communications applications described in this proposal,the military will also be interested in the heterogeneous integration technolog

* information listed above is at the time of submission.

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