Large Area, Bump Bondable, InAlAs APD arrays fro 3-D eye-safe LADAR Applications

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8651-04-C-0141
Agency Tracking Number: F031-0923
Amount: $749,815.00
Phase: Phase II
Program: SBIR
Awards Year: 2004
Solicitation Year: 2003
Solicitation Topic Code: AF03-143
Solicitation Number: 2003.1
Small Business Information
27-2 Wright Road, Hollis, NH, 03049
DUNS: 006591721
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Walter Buchwald
 (603) 465-5686
 walter@solidstatescientific.com
Business Contact
 Linda Bouthillette
Phone: (603) 645-5686
Email: linda@solidstatescientific.com
Research Institution
N/A
Abstract
Solid State Scientific Corporation (SSSC) proposes to design, fabricate and test a 256 x256 array of InGaAs/InAlAs based avalanche photodiodes (APDs) for Munitions Directorate, eye-safe, staring 3-D LADAR receiver applications. This high gain array will have all front-side fabrication completed as a full wafer process from commercially available, ultra-uniform, 3" epitaxial grown material. The final array will be designed as a backside illuminated device and as such will require backside processing after the full wafer is diced into individual arrays. Backside processing will include thinning, backside AR coating and backside alignment and metallization. Statistical test methods will be used to determine yield of the 65k pixel array and it will be suitable for bump bonding once complete.

* Information listed above is at the time of submission. *

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