SBIR/STTR Phase I:Multimodal High-Conductivity Filler for Epoxy Molding Compounds

Award Information
Agency:
National Science Foundation
Branch
n/a
Amount:
$99,987.00
Award Year:
2002
Program:
SBIR
Phase:
Phase I
Contract:
n/a
Award Id:
58578
Agency Tracking Number:
0215224
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
640 North Main, North Salt Lake, UT, 84054
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
JaredSommer
(801) 631-5500
jsommer@alum.mit.edu
Business Contact:
() -
Research Institute:
n/a
Abstract
This Small Business Innovation Research (SBIR) Phase I Project will investigate the feasibility of incorporating diamond powder in epoxy molding compounds at high packing densities using optimized multi-modal distributions of diamond powder. The resulting thermalconductivities of these composite encapsulants are expected to be higher than 100 W/mK. Selection of semiconductor molding compounds that exhibit high thermal conductivity are crucial in dissipating heat generated by high-power electronic components, particularly as feature sizes of future chips decrease in size. Most epoxy molding compounds used to encapsulate semiconductors contain fused silica (55-70% by volume) to maintain a compatible thermal expansion coefficient and impart moisture resistance. However, the resulting thermal conductivities of the composite compounds are very low (<3 W/mK). By loading commercial molding epoxies with optimized diamond powder distributions, diamond volume fractions above 65% may be obtained in the epoxy molding liquid with a viscosity compatible with commercial molding processes. The diamond/epoxy molding compound will serve as a upper-limit benchmark material for thermal conductivity and will be used in high-performance microelectronic packaging applications where heat dissipation is critical.

* information listed above is at the time of submission.

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